The Al diamond composite consists of an Aluminium matrix which contains finely dispersed diamond particles. The light-weight compound material exhibits enhanced thermal conductivity and the thermal expansion is adapted to commonly used semiconductor materials.

Advantages of Al diamond composites:

• Excellent thermal conductivity (440-530 W/mK at 20°C)
• Low coefficient of thermal expansion (7.0-9.0 ppm/K at 20°C)
• Well adapted to semiconductors and ceramics

Typical thermal management applications of Al diamond composites:

• Base plates for power electronic modules (e.g. IGBT)
• Heat sinks and base plates in the power, micro and optoelectronics