Copper-diamond composites consisting of a high volume fraction diamond provide a fitting solution to existing thermal management issues with their excellent thermal conductivity (>450 W/m.K) and a tailorable CTE matching that of the semiconductor material. These composites are available with a machinable surface for further surface operations such as milling, lapping for realizing surfaces of optical quality. Metallization of high purity elements or combinations thereof like Ni, Ni/Au, Au, Ag, Ru etc is offered for various applications.
Advantages of Cu diamond composites:
- Excellent thermal conductivity (470 W/mK at 20°C)
Low coefficient of thermal expansion (6.7 at 20°C)
Well adapted to semiconductors and ceramics
Typical thermal management applications of Cu diamond composites:
- Heat spreaders and heat sinks for microprocessor packages
- Substrates, submounts and heat spreaders for high power laser diodes and diode arrays
- Base plates for automotive and power electronics
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