The Ag diamond composite consists of a silver alloy reinforced with a high volume content of diamond particles. The compound material features an excellent thermal conductivity and a relatively low thermal expansion which is well adapted to semiconductors and ceramics. For precision-machining of surfaces and edges, such as  milling or lapping, the parts can be metallized with a machinable layer of Ag or Cu. Metallization of high purity elements or combinations thereof like Ni, Ni/Au, Au, Ag, Ru etc is offered for various applications.

Advantages of Ag diamond composites:

• Excellent thermal conductivity (550-650 W/mK at 20°C)
• Low coefficient of thermal expansion (5.8-6.4 ppm/K at 20°C)
• Well adapted to semiconductors and ceramics

Typical thermal management applications of Ag diamond composites:

• Heat sinks and heat spreaders in high performance micro- and optoelectronic packages