Advanced metal diamond composites with Silver, Aluminum and Copper matrices exhibit high thermal conductivity in the range of 400-700 W/mK and suitable CTE of about 6-9 ppm/K matching that of most semiconductor materials. The metal diamond composite has reached a degree of maturity opening thermal management applications in current and future high end technological fields such as high-power laser diode packaging, LED, and microprocessor units.

PLANSEE currently offers custom diamond composites based on silver, aluminum, and copper matrices for semiconductor electronics, LED, and laser packages.

Advantages of diamond composites for thermal management applications:

• Superior thermal conductivity with controlled expansion
• Isotropic thermal properties for excellent thermal spreading
• Metallized surfaces for optimal surface quality
• Ni/Au standard coatings and other custom coatings available
• Easy die attach with standard solder and other thermal interface materials (TIM)
• Reduced thermal stresses for better device performance and reliability