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Wafer Carrier

Our product portfolio for MOCVD (Metal organic chemical vapour deposition components) covers all critical components in molybdenum as well as tungsten as a replacement for rhenium. The geometries and material compositions of Suszeptoren blades, heating elements, spindles, heat shields and reactor insert assemblies are tailored to suit the specific requirements of the equipment of each individual manufacturer and guarantee a problem-free production process.

 

 

 

PLANSEE delivers


 

  • Susceptor blades: The high purity and homogeneity of molybdenum produced by powder-metallurgy ensures an absolutely even surface structure.

 

  • Tungsten and tungsten-rhenium heating elements: Tungsten is a cost-effective alternative material to pure rhenium for the manufacture of MOCVD heating elements. Tungsten-rhenium alloys (26% or 5% rhenium) combine the properties of both materials and provide the required electrical conductivity.

 

  • Top and bottom heat shields: Molybdenum heat shields are extremely heat resistant and can be supplied as standard products from stock.

 

  • Spindles: Our molybdenum spindles meet the highest requirements with respect to coaxiality and lifetime. To avoid breaking spindles during the replacement of short-life consumables we recommend the use of TZM screws.

 

  • Small parts: Connector rods, connector blocks, screws and nuts.

 

  • Reactor insert assemblies: Molybdenum insert assemblies regulate the stable gas flow and enable the supply of wafers in the equipment.

 

 

The advantages of our materials

 

  • High melting point: Suitable for high temperature applications up to 2000°C (Mo) and 2800°C (W)
  • Low vapour pressure: Ultra clean atmosphere, no contamination, ultra-high vacuum can be reached
  • High corrosion and wear resistance: Extends the lifetime of parts used with all implant gases
  • Highest material purity: Eliminates contamination in the ion implantation process

 


Advantages of metal compared to graphite for MOCVD components

 

  • No absorption of oxygen and moisture
  • No carbon contamination
  • Low distortion and thermal stresses

 


 

    For further information about our materials and components for MOCVD please contact electronics@plansee.com.

     

    We are looking forward to your request!

 

 



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