Thermal management has become one of the most critical aspects in the design of electronic packages for highly integrated micro-, power- and opto-electronic devices, that are ever increasing in integration densities and  decreasing in size. The reliability of electronic components is restricted not only to

operating temperature of the semiconductor component. The coefficient of thermal expansion (CTE) mismatch of packaging materials leads to critical mechanical stresses due to temperature changes during production and operation causing premature device failure.  

PLANSEE thermal management components are distinguished by their high thermal conductivity and a CTE matching to that of the semiconductor material. Our refractory and composite materials dissipate heat away from the active device and a matching CTE improves reliability and product life.

PLANSEE supplies:

• W, Mo, MoCu, WCu, Cu-MoCu-Cu laminates as base plates, heat sinks and heat spreaders in automotive and high power electronics
• Metal diamond composites as heat spreaders in microprocessor packages, and heat sinks in Laser diodes and Laser diode arrays
• Hermetic enclosures, housings, and packages made of W, Mo, MoCu, Kovar, Silver-Kovar, Al, AlSi, alloy 42, Cu, Steel, aluminum-graphite for RF packages, Fiber optic packages and high speed digital packages and other custom packages.

For further information please visit www.plansee-tms.com