Thermal management has become one of the most critical aspects in the design of electronic packages for highly integrated micro-, power- and opto-electronic devices, that are ever increasing in integration densities and decreasing in size. The reliability of electronic components is restricted not only tooperating temperature of the semiconductor component. The coefficient of thermal expansion (CTE) mismatch of packaging materials leads to critical mechanical stresses due to temperature changes during production and operation causing premature device failure.
PLANSEE thermal management components are distinguished by their high thermal conductivity and a CTE matching to that of the semiconductor material. Our refractory and composite materials dissipate heat away from the active device and a matching CTE improves reliability and product life.
