PLANSEE Bondingshop.

In the PLANSEE Bonding Shop, we bond, machine and package our ready-to-use sputtering targets for our customers in Asia. Our bonding team in Japan uses a special process to treat the surfaces of PLANSEE sputtering targets. This creates the perfect basis for bonding the target with the aluminum or copper backing plate.

Because only a perfect join between the backing plate and target permits good heat dissipation and high sputtering speeds. We pack the bonded targets under clean room conditions.

Contact.

PLANSEE Bondingshop K.K.
1622-1, Mutsuzaki, Sakura, Chiba 285-0812, Japan
Tel.: +81 4 3483-5691
tokyo@pbkk.co.jp

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What is bonding?

Bonding is a process similar to soldering. To mount targets in a PVD installation, they are affixed to a backing plate. This backing plate supports the target in the installation and ensures rapid heat dissipation. The backing plate is moistened with liquid solder, heated and "glued" to the target.

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