Heat Sinks made of Molybdenum/Copper and Tungsten/Copper
PLANSEE thermal management components have a thermal expansion matching that of packaging materials used in the electronics industry and show highest thermal conductivity.
Advantages:
Highest thermal conductivity owing to the use of pure W and Cu without sintering additives
Thermal expansion matching that of ceramic materials or semiconductor materials
Cost savings at MoCu by stamping process at higher quantities
Good machinability
Types of product:
PLANSEE heat sinks galvanically plated with NiAu or electroless Ni plated
Forms of delivery:
Finished products:
Heat sinks made of WCu and MoCu according to customers' drawings
Semi-finished products:
WCu plates up to 100 x 100 mm with a thickness of 0.5 to 50 mm
MoCu sheets up to 400 x 600 mm, to a thickness of 0.1 to 1.5 mm, and 400 x 400 mm to a thickness of 2 to 3 mm
