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Heat Sinks made of Molybdenum/Copper and Tungsten/Copper

Heat sinks made of WCu composites PLANSEE thermal management components have a thermal expansion matching that of  packaging materials used in the electronics industry and show highest thermal conductivity.


Advantages:

  • Highest thermal conductivity owing to the use of pure W and Cu without sintering additives
  • Thermal expansion matching that of ceramic materials or semiconductor materials
  • Cost savings at MoCu by stamping process at higher quantities
  • Good machinability

Types of product:

  • PLANSEE heat sinks galvanically plated with NiAu or electroless Ni plated

Forms of delivery:

Finished products:

  • Heat sinks made of WCu and MoCu according to customers' drawings

Semi-finished products:

  • WCu plates up to 100 x 100 mm with a thickness of 0.5 to 50 mm
  • MoCu sheets up to 400 x 600 mm, to a thickness of 0.1 to 1.5 mm, and 400 x 400 mm to a thickness of 2 to 3 mm





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