PLANSEE thermal management components have a thermal expansion matching that of  packaging materials used in the electronics industry and show highest thermal conductivity.

Advantages:

• Highest thermal conductivity owing to the use of pure W and Cu without sintering additives
• Thermal expansion matching that of ceramic materials or semiconductor materials
• Cost savings at MoCu by stamping process at higher quantities
• Good machinability

Types of product:

• PLANSEE heat sinks galvanically plated with NiAu or electroless Ni plated

Forms of delivery:

Finished products:

• Heat sinks made of WCu and MoCu according to customers' drawings

Semi-finished products:

• WCu plates up to 100 x 100 mm with a thickness of 0.5 to 50 mm
• MoCu sheets up to 400 x 600 mm, to a thickness of 0.1 to 1.5 mm, and 400 x 400 mm to a thickness of 2 to 3 mm