The Cu-MoCu-Cu laminate is a three layer rolled composite material. The middle layer consists of the composite material Mo-30Cu (wt. %) while the outer layers are made of oxygen-free, high conductivity copper (Cu-OFHC). Thermal properties can be tailored by varying the thickness ratio of the layers. Standard ratios are 1:4:1 and 2:3:2. With reduced co-efficient of thermal expansion compared to copper and still maintaining a significantly high thermal conductivity, these materials are particularly suitable as heat sinks, base plates, and contacts for the electronics industry.

Advantages of Cu-MoCu-Cu laminates for thermal management applications:

• High thermal conductivity (up to 260 W/mK at 20°C)
• Low coefficient of thermal expansion ( 8-10 ppm/K at 20°C)

Typical areas of application:

• Heat sinks and base plates in Automotive and high power electronics
• Electrical contacts in electronics

PLANSEE supplies:

The ranges of products supplied include semi-finished products such as sheets and foils, custom thermal management components, and packages for a variety of electronic applications.