SEMICON Europa is Europe's largest trade fair for microelectronics. From November 12 to 15, 2024, experts met in Munich to discuss the latest trends in the European semiconductor ecosystem. We presented our wafer journey in Hall C1 at Stand 153 – ranging from the manufacture and processing of the silicon wafers, to coating, photolithography, etching, and ion implantation, all the way to assembly of the chips (packaging).
We would like to thank all our customers who visited us at our stand and shared insightful conversations with us.
Our stand at this year's Semicon Europa
The Plansee team at Semicon 2024
This year's Plansee giveaways
A selection of our refreshments at Semicon
The Plansee stand at Semicon 2024
Our wafer journey exhibition
The trade fair team on day 3
We are the leading provider of products and solutions for the entire semiconductor supply chain and the world's largest manufacturer of powder-metallurgical components made from high performance materials. Our primary focus lies in lithography, etching, thermal evaporation, PVD coating, ion-beam treatments, ion implantations, MOCVD, and IC packaging. We also offer global refurbishment services to increase the share of reusable products on the market.
After over a century working with molybdenum, tungsten, tantalum, and their alloys, we have all the necessary expertise to realize even the most demanding projects: from the development of new products and components through to the design and machining of complex parts. With decades of experience in the industry, we know the market inside out and exactly what our customers need.
Plansee does business in 28 countries around the world, including 12 production plants in Europe, Asia, and the US. We are therefore in a position to ensure a reliable global supply chain for your products, components, and assemblies.
Take a quick look at our different processes at Plansee:
The PVD sputtering process
Molybdenum and tungsten in the thin-film industry
Clean room assembly at Plansee