Thermal management plays a crucial role in electronics, and in particular in the development and manufacture of power electronics, where efficient heat dissipation is essential for the reliability and longevity of components. Plansee is a leader in the production and processing of tungsten-copper (WCu) materials and refractory metals such as molybdenum and tungsten, which are ideal for such applications due to their unique properties.
Electronic power components and power modules exhibit high heat losses due to advances in the development of semiconductors and therefore need to be mounted on substrates or base plates, which act as heat sinks and heat spreaders to enable effective heat removal. This requires the use of special materials adapted to the relevant semiconductor (silicon, silicon carbide, gallium arsenide, and gallium nitride), and which exhibit both high thermal conductivity and low thermal expansion properties. Plansee's thermal management materials perfectly combine these characteristics and are therefore used in a wide range of applications including e-mobility and mobile communications (high-power signal amplification).
We supply products such as sheets, plates, blocks, and blanks in various dimensions as well as finished components that can be processed and coated (Ni/Ag, Ni/Au, Ru, Ru/Ag) in accordance with customer requirements. Three different coating technologies are used: electroplating, chemical coating, and sputter coating (PVD).
You can rely on Plansee as a partner with over a century of experience in manufacturing high-quality coating materials. That's why customers have been depending on our expertise and our products for many years now. Our materials scientists and engineers will work together with you to develop tailored solutions for your individual applications.
In-house production
(from powder to finished part)
Decades of application
knowledge
Outstanding material
properties
Exceptional product quality
Our materials experts are constantly working on the further development of our materials and their properties in the manufacturing and application processes. The special characteristics of the materials tungsten, molybdenum, and tungsten copper as well as their homogeneous microstructure result in very good material properties.
| WCu10 | WCu15 | WCu20 | Mo | W | |
| Cu content | [wt.%] | 10 ± 2% | 15 ± 2% | 20 ± 2% | 0% | 0% |
| Density | [g/cm3] | 17.1 | 16.4 | 15.5 | 10.2 | 18.2 |
| CTE (RT–400°C) | 10-6 /K | 6.6 - 7.0 | 8.0 - 8.2 | 9.2 - 9.5 | 5.2 | 4.4 |
| CTE (RT–800°C) | 10-6 /K | 6.1 - 6.4 | 7.6 - 7.8 | 9.5 - 9.7 | 5.8 | 4.7 |
| Thermal conductivity | at 20°C | W/mK | 194 - 210 | 218 - 220 | 236 - 238 | 142 | 174 |
| Thermal conductivity | at 100°C | W/mK | 187 - 199 | 215 - 218 | 230 - 234 | 117 | 154 |
| Hardness | HV10 | 288 - 309 | 255 - 258 | 221 - 244 | 231 | 460 |
Die Kombination von Wärmeleitfähigkeit (TC) und Wärmeausdehnungskoeffizient (CTE) macht das WCu-Material sehr geeignet für SiC- und GaN-Anwendungen (4,0 x 10-6/K / 5,8 x 10-6/K).
Our input material varies depending on composition; we can offer our customers the following input materials:
WCu10 & WCu15:
Standard sizes: 100x100x40
Special dimensions can be agreed on inquiry.
WCu20:
Standard sizes: 100x100x40 or 200x200x30-40
Special dimensions can be agreed on inquiry.
Cut, sawn or pre-machined blocks.
Special dimensions can be agreed on inquiry.
In addition to input materials and semi-finished products, Plansee also manufactures finished parts to customer specifications. Thanks to our many years of experience in the field of manufacturing, we are also able to produce complex components. |
To further optimize and adapt the properties of our products, we coat them with a wide variety of materials in collaboration with our global partners:
Please contact us so that we can work with you to find the right solution for you.
WCu as our successor to the MoCu heat conductors, with up to 30% higher thermal conductivity
