Meet our materials experts at PCIM Europe.
Good thermal and electrical conductivity coupled with appropriate thermal expansion:
This makes molybdenum and tungsten ideally suited for cooling semiconductor-based components such as IGBT modules, RF packages, LED chips, semiconductor diodes, transistors and thyristors.
We manufacture both - semifinished products and customized heat spreaders, heat sinks and base plates from tungsten, molybdenum, molybdenum-copper (MoCu) and tungsten-copper (WCu). We have adjusted the composition of these composite materials to perfectly meet the requirements of our customers.
Meet us:
PCIM Europe in Nürnberg/Germany
20. - 22. May 2014
Booth. No. 428 / Hall 6
Or find you local contact person here.