Molybdenum-copper-composites for the advanced thermal management of modern electronics

In the field of thermal management of gallium nitride based electronic devices, molybdenum-copper-composites play an important role.

Molybdenum-copper-composites are interesting materials in the field of thermal management of gallium nitride based electronic devices. Depending on the application and packaging requirements, the coefficient of thermal expansion and thermal conductivity can be tailored for these composites by varying structure and composition. At the 19th Plansee Seminar Martin Seiss gave an overview on thermophysical properties, electrical resistivity as well as interface reliability and stability.

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