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Semiconductor base plates

Strong base for semiconductors

Our molybdenum and tungsten make sure that power diodes, thyristors, and transistors remain in their comfort zone during use. The similar thermal coefficient of expansion provides the semiconductor with a solid functional basis. What's more, the material purity of our products ensures a reliable, high thermal conductivity, thereby playing a key role in maintaining the comfort zone for the modules.

Your advantages at a glance:

  • Individual design according to requirements

  • Perfect coating: PVD and electroplated

  • Customer-specific packaging in the clean room

  • Everything from a single source – from prototype to series production

We stay in the comfort zone

Our base plates have a similar thermal coefficient of expansion to the semiconductor material. This reduces mechanical tensions between the semiconductor and its base plate, guaranteeing a particularly long service life of the modules. The ultrapure PVD process creates a particularly homogeneous coating. In order to guarantee a high material purity during coating, we set our own PVD targets based on decades of experience. Alternatively to the PVD process, we also offer coatings using the electroplating process.

Once the coating has been applied, the next logical step is for us to provide customer-specific packaging in the clean room.

Semiconductor base plates – round, angular, or deep?

Semiconductor base plates

Flexibility in the design and the coating is a matter of course for us. Would you like to test our products? No problem – we'll be on hand from the first prototype all the way through to series production.

You can count on the quality of our semiconductor base plates:

 

Molybdenum

Tungsten

Purity [%]

99.97

99.99

Thermal coefficient of expansion at 20°C [ppm/K]

5.2

4.2

Thermal conductivity at 20°C [W/(m·K)]

142

164

Semiconductor base plates

The perfect coating for your application

You decide on the best coating for you: ruthenium, nickel, chromium, silver, or gold. Some of these metals provide optimum protection against oxidation, others improve the electrical contact. The coating depends on your particular application.

Excellent quality from a single source

We have combined our expertise in product manufacturing under a single roof: from the raw material all the way through to the final product.

    Oxide
    Reduction
    Mixing alloys
    Pressing
    Sintering
    Forming
    Heat treatment
    Mechanical processing
    Quality assurance
    Recycling
OxideMolymet (Chile) is the world's largest processor of molybdenum ore concentrates and our main supplier of molybdenum trioxide. The Plansee Group holds a 21.15% share in Molymet. Global Tungsten & Powders (USA) is a division of the Plansee Group and our main supplier of tungsten metal powder.

Our flexible design

Typical dimensions for our semiconductor base plates made of molybdenum and tungsten:

Molybdenum discs

Thickness: 0.1 mm ≥ 7.0 mm
Diameter: 2.5 mm ≥ 150.0 mm

Tungsten discs

Thickness: 0.4 mm ≥ 7.0 mm
Diameter: 2.5 mm ≥ 150.0 mm

Square and rectangular molybdenum

Thickness: 0.1 mm ≥ 5.0 mm
Long side: 1.0 mm ≥ 70.0 mm
Short side: 0.2 mm ≥ 10.0 mm

Square and rectangular tungsten

Thickness: 0.4 mm ≥ 5.0 mm
Long side: 1.0 mm ≥ 70.0 mm
Short side: 0.2 mm ≥ 10.0 mm

 

Would you like more information about our base plates as well as their properties and advantages? Read our product brochures here:

Base plates for power electronics