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Molybdenum sputtering targets

Molybdenum sputtering targets

Molybdenum layers are the main components of thin-film transistors in TFT-LCD and OLED screens, where they control the individual pixels.

A very fine layer of electrically conductive molybdenum is essential for controlling displays of any type, and sputtering targets are required to apply this layer. During this process in a vacuum chamber, the molybdenum sputtering targets are ejected from the target material by bombarding it with argon ion atoms. The atoms are ionized in the argon plasma and deposited on the display, creating a very fine layer.

Molybdenum layers are also used for other purposes. For example, as the back contact in thin-film solar cells (CIGS, CdTe) and in microelectronics components (semiconductor components, SAW/BAW frequency filters, lithography).

Your advantages at a glance:

  • High purity
    > 99.97%

  • Maximum density
    > 99.5%

  • Homogeneous microstructure

  • Center of expertise for new coating solutions

  • Ideal texture for specific application

How are molybdenum layers produced?

During the magnetron sputtering process (PVD process), metal atoms are released from the sputtering targets, which settle as a thin film on the material to be coated (known as the 'substrate'). This process is a cost-effective and fast coating process in which all materials must satisfy the most stringent quality criteria.

Explanation of the PVD process

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Wide selection of target formats

We produce planar and tubular molybdenum targets in a single- and multi-part design for all common dimensions and coating systems.

Maximum purity

Metal and non-metal impurities in the sputtering target are transferred to the sputtered functional layer, thereby affecting its function or causing particle formation in the PVD process (arcing effect).

For this reason, sputtering targets must meet the highest purity requirements. The main advantages are excellent electrical conductivity of the layer, minimum particle formation during the PVD process, and homogeneous coating rates over the lifetime of the sputtering target.

We guarantee that our molybdenum targets have a minimum purity of 99.97% (3N7). The typical purity of our molybdenum targets is 99.99%. This is how we guarantee that the layers produced satisfy the stringent requirements. We even go so far as to guarantee a minimum purity of 99.995% (4N5) for applications in the semiconductor industry.

Highest density and homogeneous microstructure

Our molybdenum sputtering targets are highly compressed by means of special forming processes. This results in increased and homogeneous coating rates and improved coating properties in the PVD coating process. The advantages of this lie in the efficiency of the thin film production as well as a high output.

We can adjust the microstructure of the coating material in a targeted manner by means of our manufacturing process. Sputtering targets with a uniform microstructure and texture ensure consistent sputtering rates and thickness of the film.

Partnering to develop new coating solutions

In the PVD coating process, everything must be perfectly matched. It is only if all process parameters are perfectly matched that the layer that suits the customer's exact requirements can be produced. Having worked with system manufacturers and scientific institutes for many years, we are directly involved in the latest developments and optimizations. Our team of developers creates film systems and analyzes them in detail according to defined specifications. This means that new coating materials are developed in a very short time in cooperation with customers and numerous development partners.

Highest quality from a single source

We have the entire value-added chain for our sputtering targets under one roof: from the procurement of conflict-free raw materials through to the final product. Powder blanks form the basis for manufacturing compacted, metal products. Our hot-rolling mill for refractory metals produces planar targets. We produce rotary targets using our own forming process. Following the machining process, we finalize the sputtering targets ready for installation in our local bonding shops using a range of bonding techniques.

With a shareholding in Molibdenos y Metales (Molymet), the Plansee Group covers all of the steps involved in molybdenum processing. From producing the powder to powder metallurgical processes, all the way through the production of semifinished products and customer-specific components.

    Oxide
    Reduction
    Mixing alloys
    Pressing
    Sintering
    Forming
    Heat treatment
    Mechanical processing
    Bonding
    Quality assurance
    Recycling
OxideMolymet (Chile) is the world's largest processor of molybdenum ore concentrates and our main supplier of molybdenum trioxide. The Plansee Group holds a 21.15% share in Molymet. Global Tungsten & Powders (USA) is a division of the Plansee Group and our main supplier of tungsten metal powder.

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