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WTi sputtering target

Tungsten-titanium sputtering targets

The high density of tungsten, the good corrosion resistance and adhesion of titanium on many surfaces, and the good miscibility of both metals make tungsten-titanium the ideal material for thin layers. This prevents the diffusion of foreign atoms.

Your advantages at a glance:

  • High purity
    > 99.95%

  • High density
    > 98%

  • Homogeneous microstructure

  • High sputtering
    speeds thanks to maximum material density

  • Consistent sputtering rate thanks to optimized microstructure

Our product specification available for download:

WTi sputtering target specification
Areas of application for tungsten-titanium

Containing ten percent by weight titanium, tungsten-titanium (WTi) is used as a diffusion barrier and adhesive agent for metallization in microchips. In this area of application, WTi separates the semiconductor and metallization layers, e.g., aluminum from silicon or copper from silicon. Without diffusion barriers, copper and silicon would form an intermetallic phase in microchips and thereby impair the function of the semiconductor. In the case of flexible thin-film solar cells (CIGS), a WTi barrier layer prevents iron atoms from diffusing from the steel substrate through the molybdenum back contact and into the CIGS semiconductor. Just a few µg/g of iron can significantly reduce the efficiency of CIGS solar cells.

WTi layer in a CIGS solar cell

The two figures show the schematic structure of a CIGS solar cell (left) and a flip chip semiconductor metallization (below) using WTi layers.

WTi layer in a semiconductor metallization

Example applications for WTi layers

WTi sputtering targets

We manufacture our WTi sputtering targets using innovative powder metallurgical production processes. We provide our WTi sputtering targets in various sizes up to a diameter of 400 mm. As such, we are one of the first manufacturers to produce WTi not only as a planar target but also as a rotary target. Our WTi targets typically have a titanium content of 10 percent by weight.

WTi from Plansee: Overview of properties
Density ≥ 98%
Purity > 99.95%
Titanium content 10% by weight
Homogeneity of titanium distribution ± 0.5%
Microstructure Fine grain, < 50 µm grain size

Unsurpassed material purity for top quality

Center of expertise for sputtering targets

The purer the coating material, the better the quality of the layer. From the outset, we only use the purest powder and mix this in our own facilities to guarantee the highest material purity. We monitor every step – from the powder to the finished product – ensuring that only targets with the specific guaranteed density, purity, and a homogeneous microstructure leave our factory.

Everything from a single source – from the powder to the finished target

WTi layers are manufactured by means of a PVD sputtering process. We provide the source material in the form of sputtering targets. Our material has a high density, a high material purity, and a homogeneous phase composition in order to guarantee a stable coating process. We have the entire production process under one roof; from mixing and pressing the metal powder to forming, machining, and bonding our targets, we oversee every step in the process. This means that we can guarantee a consistently high quality over a long period of time. Also included is the development of new materials to optimize coating processes and layers. And of course we test the quality of our targets using state-of-the-art measurement methods.

    Mixing alloys
    Heat treatment
    Mechanical processing
    Quality assurance
OxideMolymet (Chile) is the world's largest processor of molybdenum ore concentrates and our main supplier of molybdenum trioxide. The Plansee Group holds a 21.15% share in Molymet. Global Tungsten & Powders (USA) is a division of the Plansee Group and our main supplier of tungsten metal powder.

Take a look at exactly how the PVD process works:

The high density and purity of our WTi targets help reduce particle formation during the coating process – an important factor in producing optimum coating results. The correlation between particle formation and target properties has been investigated within the scope of the following scientific work, for example:

Journal of Vacuum Science & Technology A: "Particle contamination during sputter deposition of W-Ti films" 

To the publication

Journal of Vacuum Science & Technology A: "Quantitative measurement of nodule formation in W-Ti sputtering"

To the publication

Powder Metallurgy Review, J. Winkler, C. Linke: "Sputtering targets: The advantages of Powder Metallurgy in the production" 

To the publication

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