Tungsten layers are components of thin-film transistors in TFT-LCD screens. They are used when large screen formats, a particularly high image definition, and optimized contrasts are required. Tungsten targets are also used in microelectronics, for example for creating layers in frequency filters (SAW/surface acoustic wave filter, BAW/bulk acoustic wave filter). Other applications for tungsten targets include diffusion barriers made of tungsten-nitride, conductor tracks in microelectronic components as well as reactively sputtered transparent layers made from tungsten oxide for OLED displays and for use in electrochemistry.
High purity
> 99.97%
Maximum density
> 99.5%
Center of expertise for new coating solutions
Homogeneous microstructure
Ideal texture for specific application
During the magnetron sputtering process (PVD process), metal atoms are released from the sputtering targets, which settle as a thin film on the material to be coated (known as the 'substrate'). This process is a cost-effective and fast coating process in which all materials must satisfy the most stringent quality criteria.
Metal and non-metal impurities in the sputtering target are transferred to the sputtered functional layer, thereby affecting its function or causing particle formation in the PVD process (arcing effect).
For this reason, sputtering targets must meet the highest purity requirements. The main advantages are excellent electrical conductivity of the layer, minimum particle formation during the PVD process, and homogeneous coating rates over the lifetime of the sputtering target.
We guarantee that our tungsten targets have a minimum purity of 99.97% (3N7). The typical purity of our tungsten targets is 99.99%. This is how we guarantee that the layers produced satisfy the stringent requirements. We even go so far as to guarantee a minimum purity of 99.999% (5N) for applications in the semiconductor industry.
Our tungsten sputtering targets are highly compressed by means of special forming processes. This results in increased and homogeneous coating rates and improved coating properties in the PVD coating process. The advantages of this lie in the efficiency of the thin film production as well as a high output.
We can adjust the microstructure of the coating material in a targeted manner by means of our manufacturing process. Sputtering targets with a uniform microstructure and texture ensure consistent sputtering rates and thickness of the film.
In the PVD coating process, everything must be perfectly matched. It is only if all process parameters are perfectly matched that the layer that suits the customer's exact requirements can be produced. Having worked with system manufacturers and scientific institutes for many years, we are directly involved in the latest developments and optimizations. Our team of developers creates film systems and analyzes them in detail according to defined specifications. This means that new coating materials are developed in a very short time in cooperation with customers and numerous development partners.
We have the entire value-added chain for our sputtering targets under one roof: from the procurement of conflict-free raw materials through to the final product. Powder blanks form the basis for manufacturing compacted, metal products. Our hot-rolling mill for refractory metals produces planar targets. We produce rotary targets using our own forming process. Following the machining process, we finalize the sputtering targets ready for installation in our local bonding shops using a range of bonding techniques.
With Global Tungsten & Powders, the Plansee Group covers all of the steps involved in tungsten processing. From producing the powder to powder metallurgical processes, all the way through the production of semifinished products and customer-specific components.
Molybdenum sputtering targets
Molybdenum sputtering targets/rotary targets
Molybdenum-sodium sputtering targets
Molybdenum-niobium sputtering targets
Molybdenum oxide sputtering targets
Molybdenum-tantalum sputtering targets
Molybdenum-tungsten sputtering targets
Tungsten-nickel sputtering targets
Tungsten-titanium sputtering targets
